Capabilities | Standard |
Board types | Multilayer up to 50 layers |
Material | FR4, FR5, FR406, FR408, High-TG(TG>170 ℃), CEM-1, Aluminum and Copper base, Teflon |
Minimum Trace width | 0.08mm |
Minimum Track Width to feature spacing | 0.075mm |
Smallest drilled hole | 0.08mm |
Material Thickness | 0.1mm-6.0mm |
Copper Thickness | Up to 6 oz Cu |
Max board size | 500 mm x 700mm |
Tolerance of dimension | ±0.08mm |
Tolerance of thickness (t ≥0.8mm) | ±8% |
Tolerance of thickness (t ≤0.8mm) | ±10% |
Solder Mask | SMOBC, LPI or Dry Film |
Surface finish | Hot Air Solder Level(HASL) Electroless Nickel / Immersion Silver, ENIG Electroless Tin Lead / Organic ( OSP ) Hard Gold ( edge contact ) / Carbon |
Silkscreen Colors | White, Yellow, Black |
Solder Mask Colors | Green, Blue, Red, Black, Clear |
Bare Board Test | Bed of Nails Simultaneous double-sided flying probe test |
Gold plate | Edge connectors Touch Pads |
Panelization | Routing, V-Groove |
High Freqyency PCB |
Flex pcb |
Aluminum pcb |
Riqid flex pcb |
Multilayer pcb up to 50 layer |
Thick copper pcb |
Carbon ink pcb |
RF pcb |