
| Capabilities | Standard |
| Board types | Multilayer up to 50 layers |
| Material | FR4, FR5, FR406, FR408, High-TG(TG>170 ℃), CEM-1, Aluminum and Copper base, Teflon |
| Minimum Trace width | 0.08mm |
| Minimum Track Width to feature spacing | 0.075mm |
| Smallest drilled hole | 0.08mm |
| Material Thickness | 0.1mm-6.0mm |
| Copper Thickness | Up to 6 oz Cu |
| Max board size | 500 mm x 700mm |
| Tolerance of dimension | ±0.08mm |
| Tolerance of thickness (t ≥0.8mm) | ±8% |
| Tolerance of thickness (t ≤0.8mm) | ±10% |
| Solder Mask | SMOBC, LPI or Dry Film |
| Surface finish | Hot Air Solder Level(HASL) Electroless Nickel / Immersion Silver, ENIG Electroless Tin Lead / Organic ( OSP ) Hard Gold ( edge contact ) / Carbon |
| Silkscreen Colors | White, Yellow, Black |
| Solder Mask Colors | Green, Blue, Red, Black, Clear |
| Bare Board Test | Bed of Nails Simultaneous double-sided flying probe test |
| Gold plate | Edge connectors Touch Pads |
| Panelization | Routing, V-Groove |
![]() High Freqyency PCB |
![]() Flex pcb |
![]() Aluminum pcb |
![]() Riqid flex pcb |
![]() Multilayer pcb up to 50 layer |
![]() Thick copper pcb |
Carbon ink pcb |
![]() RF pcb |