PCBA assembly process control

PCB assembly china process control refers to real-time monitoring and adjustment of key process steps during PCB processing to ensure processing quality. The main control points include:

1. Printing process: Monitor the printing volume, uniformity, and positional accuracy of solder paste to avoid defects such as offset and bridging;

2. SMT process: Ensure accurate placement and pin alignment of components to avoid issues such as solder joints and reverse mounting;

3. Reflow soldering: Control the soldering temperature, time, and heating rate to achieve good soldering results;

4. AOI inspection: Automatic optical inspection equipment is used to conduct quality inspection on the welded circuit board, and timely detect and handle welding defects.

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