Heat dissipation design of PCB assembly china

From the perspective of facilitating heat dissipation, it is best to install pcba assembly  upright, with a distance of generally not less than 2cm between boards, and the arrangement of components on the PCB assembly china should follow certain rules:

For equipment that uses free convection air cooling, it is best to arrange the integrated circuits in a longitudinal manner; For equipment that uses forced air cooling, it is best to arrange the integrated circuits in a horizontal and vertical manner.

2. Devices on the same PCB assembly china should be arranged in zones according to their heat generation and heat dissipation degree as much as possible. Devices with low heat generation or poor heat resistance (such as small signal transistors, small-scale integrated circuits, electrolytic capacitors, etc.) should be placed at the top (inlet) of the cooling airflow, while devices with high heat generation or good heat resistance (such as power transistors, large-scale integrated circuits, etc.) should be placed at the bottom of the cooling airflow.

3. In the horizontal direction, high-power devices should be arranged as close as possible to the edge of the PCBA assembly  to shorten the heat transfer path; In the vertical direction, high-power devices should be arranged as close as possible to the top of the PCB assembly china to reduce their impact on the temperature of other devices during operation.

4. Devices that are sensitive to temperature are best placed in the lowest temperature area (such as the bottom of the equipment), and should not be placed directly above the heating device. Multiple devices are best arranged in a staggered manner on a horizontal plane.

A large amount of practical experience has shown that adopting a reasonable arrangement of components can effectively reduce the temperature rise of pcba assembly , thereby significantly reducing the failure rate of components and equipment.

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