PCB assembly china production process flow

Edit:PCB assembly china   Browse: Times  Date:2024-08-07

PCB assembly china production process flow
The PCB assembly china  production process mainly includes the following steps:
Substrate cutting: Cut the substrate into the required size according to the pre production design, including two processes: cutting and chamfering. ‌1
Inner layer circuit production: including pre-treatment (degreasing, oxidation removal, increasing rough area), inner layer coating (wet film coating), exposure (transferring the pattern on the negative film to the photosensitive substrate), development (transferring the pattern to the substrate), etching (forming inner layer circuit pattern), film removal (removing the photopolymerization ink protecting the surface of the circuit) and other steps.
Pressing: The inner layer board is pressed with PP and copper foil to form a multi-layer circuit board, including steps such as browning (pre-treatment), riveting/pre stacking, pressing, and post-processing (preliminary shape treatment of the pressed board).
Drilling: Drilling connection holes between layers on the board surface.
Electroplating: Metallize the non-conductive parts of the hole wall with resin and fibers to achieve sufficient conductivity and welding of the metal hole wall, including steps such as deburring, slag removal, chemical copper, electroplating copper, etc.
Outer layer circuit production: including pre-treatment (removing copper surface pollutants, increasing copper surface roughness and contact area), pressure drying film (coating photosensitive dry film on the copper foil surface of the outer layer circuit), exposure (transferring the circuit pattern on the film to the copper foil dry film) and other steps.
In addition, according to specific requirements, the PCBA assembly  production process may also include CCD punching, AOI inspection, VRS inspection, as well as final steps such as molding, testing, and packaging. The entire process requires precise control over the conditions and timing of each step to ensure the quality and performance of the final product.
Please note that there may be certain process differences in different PCB assembly china manufacturing processes, which should be adjusted and optimized according to the actual situation. ‌
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