PCB assembly china hot air leveling treatment

 

PCB assembly china hot air leveling, also known as hot air solder leveling (commonly known as spray tin), is a process of coating the surface of PCBA assembly with molten tin (lead) solder and leveling it with heated compressed air to form a coating layer that is both resistant to copper oxidation and provides good solderability. During hot air conditioning, a copper tin intermetallic compound is formed at the junction between solder and copper. PCB should sink in the molten solder during hot air leveling; The wind knife blows flat the liquid solder before it solidifies; The wind knife can minimize the crescent shape of solder on the copper surface and prevent solder bridging.

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