PCB assembly china Organic Solderability Protective Agent

 

OSP is a process for surface treatment of copper foil on printed circuit boards (PCB assembly china) that complies with the RoHS directive requirements. OSP is the abbreviation for Organic Solderability Preservatives, translated as organic solder mask, also known as copper protectant, or Preflux. Simply put, OSP is the chemical process of growing an organic film on a clean bare copper surface.

This film has oxidation resistance, heat shock resistance, and moisture resistance to protect the copper surface from further rusting (oxidation or vulcanization, etc.) in normal environments; But in the subsequent high-temperature welding, this protective film must be easily removed by the flux, so that the exposed clean copper surface can be immediately combined with the molten solder to form a solid solder joint in a very short time.

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